Samsung is working on a FE flip-style foldable, we are hearing that there is a lot in the last few months. It is still debated whether it will be called the Galaxy Z Flip Fee or Galaxy Z Flip 7 FE, but regardless of this (we will only call it Flip FE), we now know the chipset inside.
This is because a prototype has run Geekbench, and the online database of the benchmark has revealed what is inside: Samsung’s Acinos 2400 SoC. Not 2400e, which was seen in the Galaxy S24 Fe last year, pay attention to you, but only 2400.
Samsung Galaxy Z Flip Fe SM-F761n Geekbench listing reveals Exynos 2400 chipset.
🔳 Exynos 2400 SoC
🎮 Samsung Xclipse 940 GPU
🍭 Android 16
– 8GB RAM#Samsunggalaxyzflipfe #Galaxyzflipfe pic.twitter.com/gkp6tvdyyoy– Abhishek Yadav (@Yabhishekhd) May 12, 2025
As you know, this SoC was within the Galaxy S24 and S24+ in some areas, which was launched back in January last year. While it is a long time ago in the mobile world, it was a major chipset at the time (people’s issues with exynos range on one side), and so it should probably be a decent chip for cheap flip Fe.
Of course, pricing itself will create or break this device-close to $ 500-600, most people probably have no problem with chipset choice, but if it is $ 700–800 or more, the conversation will definitely change.
Anyway, the chip was paired with 8GB of RAM in the prototype that used to run the benchmark, and the device drove the Android 16, making us feel that it could be launched with a UI 8 on the board. It also tells us that it is not coming very soon – it can be unveiled with Flip7 and Fold7 in early July, but most likely, as Google is planning to release Android 16 only in June.
Now address the elephant in the room. Last week, a leakage gave us the glasses of Flip F, and it was said that it was operated by Snapdragon 8 General 3SOC. Either this leak was wrong, or Samsung is planning to release the device with two different chips in different areas, which will not be surprising how much it has been for the family of Flagship Galaxy in the past.