Apple is trying to manufacture its own wireless chips to incorporate into its smartphone universe. Following the leak of Apple’s 5G modem in the iPhone SE 4, a recent rumor suggested that the iPhone 17 will bring in-house Wi-Fi and Bluetooth chips. Analyst Ming-Chi Kuo, posting on X, said that Apple is planning to switch to its own Wi-Fi chips from Broadcom. He also said that the tech giant expects almost all of its products to move to these Wi-Fi chips within about three years, starting with the iPhone 17. The iPhone 17 is expected to hit town in September 2025. Therefore, Apple’s Wi-Fi chips may also debut in the same year.

Additionally, Kuo said that in-house chips will help reduce the cost of products. Apple could also increase software integration by developing its own chips, but the company already operates within a tightly controlled ecosystem with strong restrictions. Amid ongoing demands for better repairability, proprietary chips may not live up to fans’ wishes.

According to Kuo, this new Wi-Fi chip will be produced using the N7 process, which is an advanced version of the technology used to manufacture the A13 Bionic chip. Additionally, it will also support the latest Wi-Fi 7 spec, which is used in the iPhone 16 series.

If Apple’s first in-house chips debut exclusively in the iPhone 17 Pro, they’ll likely expand to the full iPhone 18 lineup later. With the evolution of Apple Intelligence, the need for faster speeds and more reliable connectivity is greater than ever.

Earlier, in 2019, Apple had acquired Intel’s modem division with the goal of eliminating its dependence on Qualcomm modems. However, various reports indicate that Apple’s prototype modem suffered from a number of technical problems and failures.

iPhone 17: all leaked specifications

At the heart of the iPhone 17 lineup will be Apple’s new A19 chip – the successor to the A18 chip, which is expected to debut with this year’s iPhone 16 series. There is speculation that this A19 chip will be produced by TSMC, the world’s leading semiconductor manufacturer, using the 2-nanometer process. This new chip is said to bring improvements in performance, energy efficiency and thermal management. Along with the A19, the iPhone 17 Pro models are also expected to see a memory upgrade, with reports indicating a bump up to 12GB RAM.

Apple is also reportedly planning to introduce a new type of motherboard in the iPhone 17. This motherboard is rumored to be developed using Resin Coated Copper (RCC) technology.

It is also expected to see changes in the display technology of iPhone 17. Reports suggest that with the iPhone 17, the displays on Apple’s flagship phones could be even more scratch-resistant, potentially involving a new type of glass being developed by Corning. Additionally, there are rumors that Apple may extend the Always-On Display feature, which is currently exclusive to the Pro models, to the entire iPhone 17 lineup.